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Surface mount SMT PCB assembly service

Publish Date:2020-11-14

1、 Required documents

  1. BOM clear unit device list
  2. No welding list
  3. SMT coordinate file
  4. Device diagram
  5. Manual welding device list
  6. Make PCB of the steel mesh file
    2、 Procedures and methods of making documents
  7. BOM clear unit device list
  8. No welding list
  9. SMT coordinate file
  10. Silkscreen drawing of the product (it is recommended to make it in DXP)
    (1) Top surface parameter diagram
    (2) , top numbering diagram
    (3) , bottom parameter diagram
    (4) , bottom parameter diagram
  11. Manual welding device list
  12. PCB steel mesh file
    Surface mount SMT PCB assembly service is specialized in developing new products, SMT chip proofing, PCBA template mounting, BGA patch welding. There is no engineering cost, start-up fee, wire mesh fee, and express fee. The price is 70% lower than that of the factory. Welcome to consult the official website: http://www.ideaspcb.com/
    3、 Detailed description of the steps and methods of making each document
  13. BOM clear unit device list
    Production method: export and rearrange in the schematic diagram
    Export method: the method is the same in Protel and DXP. It is recommended to export in DXP
    Select [reports/bill of material] on the interface, and then directly select next until finish
    As shown in the figure:
  14. No welding list
    According to the first step of the list of components can be sorted out
  15. Methods and steps of SMT coordinate file export
    (1) Select [file / open ]Open a. PCB file;
    (2) Click the player and select all on the [edit/select / all on layer] layer;
    (3) Click bottom layer and select all on the [edit/select / all on layer] layer;
    (4) After finishing, press Shift + delete to delete the redundant lines on the top and bottom faces;
    (5) Select [design / options ], open the layers button, and check [toplayer] / [bottomlayer] under single layers, then [top overlay] / [bottomlayer] under silkscreen, and then select [keepout] under other;
    Note: top and bottom can also be closed separately to make it clearer.
    (6) After completing the above steps, the screen printing position map of the pad can be clearly displayed;
    (7) Select [edit/origin/set] to set the origin position (* after setting the PCB origin position, remember that the PCB origin position on the machine should also be set here);
    (8) Select [file / CAM Manager..] in the Export Wizard, select pick place, check text and click next. Select metric metric metric to generate a pick place file. Select and press F9 generate cam files;
    (9) In the [Explorer] window on the left, find the pick place. File in the cam for.. directory and right-click to export it to the target path you want;
    (10) Then open the pick place file in Excel and organize it into the files required by SMT, where mid X and mid y are the X and Y coordinates required by SMT.
    Note: top layer and bottom layer should be separated when finishing
  16. PDF document of product component position silkscreen (recommended to be made in DXP)
    (1) Top surface parameter diagram
    The schematic diagram of top parameters is the resistance and capacitance of top overlay layer, IC resistance value, capacitance value, IC name, etc. (10K, 1uF. Max354, etc.)
    Note: all parameters should be in the middle (within pad screen printing)
    Steps and methods:
    A. Open a PCB file in DXP
    B. Select top overlay and keep out layer only
    C. Hide the device number, only display the device parameters, but the parameters of each device in the pad screen printing, in the middle, pay attention to the uniformity and direction
    D. Select [file / smart PDF ]Export to PDF file
    The details are as follows
    Go straight to the next step until it’s done
    Note: Figures 2, 3, and 4 show that only top overlay and keep out layer layers are output
    Left-click to select the layer, right mouse button to select Delete layer and add a layer
    Delete is to delete a layer; insert layer is to add a layer
    (2) , top numbering diagram
    The schematic diagram of top numbering, i.e. the numbers of resistors, capacitors, and IC of top overlay layer (R1, C1, U1, etc.)
    Note: the numbers should be in the middle (within the pad screen printing)
    Steps and methods:
    A. Open a PCB file in DXP
    B. Select top overlay and keep out layer only
    C. Hide the device parameters, only display the device number, put the device number in the pad screen printing, in the middle, pay attention to the uniformity and direction
    D. Select [file / smart PDF ]Export to PDF file
    The details are the same as the first step above
    (3) , bottom parameter diagram
    The bottom parameter diagram is the resistance and capacitance of the bottom overlay layer, the resistance value, capacitance value, and IC name of IC (10K, 1uF. Max354, etc.)
    Note: all parameters should be in the middle (within pad screen printing)
    Steps and methods:
    A. Open a PCB file in DXP
    B. Select to show only bottom overlay and keep out layer
    C. Hide the device number, only display the device parameters, but the parameters of each device in the pad screen printing, in the middle, pay attention to the uniformity and direction
    D. Select [file / smart PDF ]Export to PDF file
    The detailed steps are basically the same as the first step above
    The difference is that only output bottom overlay and keeps out layer is selected, as shown in the following figure:
    Export steps of patch screen printing
    Export steps of patch screen printing
    (4) , bottom parameter diagram
    Schematic diagram of bottom numbering, i.e. numbers of resistance, capacitance, and IC of bottom overlay layer (R1, C1, U1, etc.)
    Note: the numbers should be in the middle (within the pad screen printing)
    Steps and methods:
    A. Open a PCB file in DXP
    B. Select to show only bottom overlay and keep out layer
    C. Hide the device parameters, only display the device number, put the device number in the pad screen printing, in the middle, pay attention to the uniformity and direction
    D. Select
Surface mount SMT PCB assembly service

How to understand the surface mount SMT PCB assembly service file provided by customers
Generally, there are several kinds of files provided by customers. If you are a novice in the surface mount SMT PCB assembly service industry, it may take some time to fully understand these file types. As the saying goes, “if a worker wants to do a good job, he must first sharpen his tools.”. For beginners in the field of surface mount SMT PCB assembly service, this article is worth reading.
Customer documents are generally divided into single-sided documents and double-sided documents. Generally speaking, it is only done on the front or backside, and both sides are done. Of course, there is also a kind of Yin-Yang board, which is a mixture of positive and negative sides (this will be explained as a special case later.)
The front side is usually called top (T) surface or top surface, and the reverse side is generally called bottom (BOT, b)
The following is the understanding of the positive and negative documents:
In the first case, the engineering documents with the suffix art are front files (also called top-level documents). The following are all front-end

Surface mount SMT PCB assembly service

documents:
Front patch layer: TP, paste top, stop, SMT top (sometimes this is also a solder mask layer. Pay attention to the circuit layer to identify the upper part and lower part).
Front solder mask: BS, pastebottom, smkbot, SMK bot
To, top silk,
Side screen layer: Bo, bottom silk
General drilling layer: drill, shape layer Ko, PCB, cutting outside
Test point layer: Test front test point: Test top aspect test point: Test BOT
The composition is generally as follows: pinball.art Either multi-up, PDF drawings with the good size provided by customers, or CAD files of DXF.
In the second case, the project files are combined with the suffixes pho and Rep.
Of course, the way to know them is the same as above, but when importing files, you must pay attention to importing two files together. Remember.
The third case is that the suffix provided by the customer is pcb.doc Generally, PROTEL 99SE or DXP (the short name of the Design Explorer) or Protel DXP are used. The exported files are generally the same as those in the first case.
In the fourth case, the suffix of the file provided by the customer is PCB, which requires the use of pads series software to export files. Generally, the exported files are in this form. SMD and SM files are paired together. Generally, regular files such as SM 23,smd… 23. The combined file is the front patch layer. The solder mask with the mantissa of 21 is the front solder mask, which can be seen more clearly in the following figure:
The names of the rest of the profile layer, mosaic layer, and drilling layer can be judged according to the first case.
In the fifth case, customers provide CAD files, usually DXF or DWG. As long as CAD can open the files, the files are valid
In general, the drawings were drawn by CAD only need to be transformed or modified slightly. Therefore, you need to change your mind to see this situation. The requirements of customers and the transfer out of this document are very important. Because the author’s computer is installed with CAD, this paper provides a method to transfer CAD out of Gerber.
As shown in the following figure: This is a simple CAD drawing project file:
Click the file (f) in the upper left corner of the CAD toolbar to enter the save as step
Be sure to choose the last DXF to save. (if this effect is not satisfied sometimes, you can consider the DXF file type of 2004 or 2007)
At this point, you can successfully export the DXF file. You just need to import the file into CAM350 software, according to the appropriate ratio (generally 1:1).
Because the purpose of this document is only to acquaint a person who has just entered the surface mount SMT PCB assembly service industry. As for how to use the export files of DXP, pads, PROTEL 99SE, cam 350, and other series software, if there is a chance, they will be sorted out for mutual exchange and learning.
For the Yin and Yang boards (i.e. files with both sides together), it is generally well known. The only thing to pay attention to is that when importing files, you should learn to combine the front files to determine whether mirror images are needed. When handling a document, you can handle it on any side