What should be paid attention to in PCBA chip processing

Publish Date:2020-10-21

The production process of PCBA involves a series of processes, such as PCB board manufacturing, PCBA incoming electronic components procurement and inspection, SMT chip production and processing, plug-in production and processing, program firing, testing, aging, and so on. The supply chain and manufacturing chain are long, and the defects in the other stage will lead to the unqualified quality of PCBA boards in large quantities, which will lead to serious consequences. In this case, the quality control of PCBA chip processing is a very important quality assurance in electronic processing. What are the key points of quality control in PCBA processing?

It is very important to hold a pre-production meeting after receiving the order for PCBA production and processing. It mainly focuses on the process analysis of PCB Gerber documents and the submission of manufacturability reports (DFM) according to different customer requirements. Many small manufacturers do not pay attention to this but tend to do so. It is not only easy to produce bad quality problems caused by bad PCB design, but also a lot of rework and repair work.

What should be paid attention to in PCBA chip processing
  1. Purchase and inspection of electronic components for PCBA incoming materials
    It is necessary to strictly control the procurement channels of electronic components, and the goods must be taken from large traders and original manufacturers, so as to avoid the use of second-hand materials and counterfeit materials. In addition, it is necessary to set up a special PCBA incoming material inspection post to strictly inspect the following items to ensure that there is no fault in the components.
    PCB: check reflow oven temperature test, no flywire through-hole is blocked or ink leakage, board surface bending, etc.
    IC: check whether screen printing and BOM are exactly the same, and store them at constant temperature and humidity.
    Other commonly used materials: check screen printing, appearance, power measurement, etc.
  2. SMT assembly
    Solder paste printing and reflow furnace temperature control system is the key point of assembly, which requires the use of laser steel mesh with higher quality requirements and better meet the requirements of production and processing. According to the requirements of PCB, some steel mesh holes or U-shaped holes need to be added or reduced, and only steel mesh can be made according to the process requirements. The temperature control of the reflow furnace is very important for the wetting of solder paste and the firmness of steel mesh welding, which can be adjusted according to the normal SOP operation guide.
    In addition, the strict implementation of AOI testing can greatly reduce the adverse effects caused by human factors.
  3. Plug-in production and processing
    In the process of the plug-in, the mold design of over wave soldering is the key. How to use the mold to improve the yield of good products is a process that PE engineers must continue to practice and summarize.
  4. PCBA production process board test
    For the order with PCBA test requirements, the key test contents include ICT (circuit test), FCT (function test), burn test (aging test), temperature and humidity test, drop test, etc.