The utility model relates to the technical field of PCB board, particularly to a low-cost PCB assembly with convenient assembly.
PCB board, also known as the printed circuit board, is the electrical connection of electronic components. The main advantage of using the circuit board is to greatly reduce wiring and assembly errors and improve automation and production labor rate. At present, according to the number of PCB layers, PCB can be divided into a single panel, double-sided board, four-layer board, six-layer board, and other multilayer circuit boards.
The PCB board structure is generally composed of a substrate layer and a conductive layer above the substrate layer, and the substrate layer is an insulating layer. In applying the PCB board, the corresponding electronic components will be welded on the electronic component pad on the PCB board’s conductive layer. In the existing technology, the connection between electronic components and the conductive layer is mostly by welding, which has the defects of a cumbersome process, inconvenient assembly, and high production cost. Moreover, the pins of electronic components are fixed on the pad by soldering tin. There may be false soldering.
Also, due to the poor thermal conductivity of the resin composite material of the insulating layer, the heat generated by the work of electronic components is mainly transmitted to the external air through the conductive layer’s copper foil. However, the thickness of the copper foil is minimal, and the thermal conductivity is limited. Therefore, it is usually necessary to set a heat dissipation layer at the insulation layer’s bottom. In the existing technology, the heat dissipation layer is generally connected with. However, these methods have the defects of inconvenient assembly.
Technical implementation elements:
The utility model aims to provide a low-cost PCB assembly that is convenient to assemble and has the advantages of easy assembly and low cost. The PCB board with convenient assembly and low cost has good heat dissipation and has the advantages of easy assembly and low production cost.
To achieve the above purpose, the utility model is realized by the following technical scheme.
A convenient and low-cost PCB assembly is provided, which includes a substrate layer, a conductive layer arranged on the upper surface of the substrate layer, some electronic components arranged on the conductive layer, a heat absorbing and cooling material layer arranged on the lower surface of the substrate layer, and dissipation vias penetrating the conductive layer, the substrate layer and the heat absorbing and cooling material layer;
The conductive layer is provided with some socket slots for inserting the pins of the electronic components, and the notch of the socket is provided with some elastic conductive sheets for sealing the notch;
Both sides of the heat absorbing and cooling material layer are provided with clasps, and the two ends of the base material layer are provided with clamping blocks for connecting with the buckle;
The plurality of heat dissipation via holes is inclined.
The longitudinal section of the inserting groove is set as a U-shaped.
The slot of the socket is provided with four elastic conductive sheets for sealing the slot.
The inclination angle of the heat dissipation through-hole is set at 5 degrees to 10 degrees.
Preferably, the inclination angle of the heat dissipation through-hole is set as 8 degrees.
Both ends of the snap are provided with expanded shrapnel.
Two expanded shrapnel are relatively arranged at the two ends of the snap.